книги Наука, техника, медицина Техника Машиностроение

Anodic bonding

Код 3316305

  • ISBN: 978-5-5147-9442-3

Нет в продаже

Аннотация к книге "Anodic bonding"

High Quality Content by WIKIPEDIA articles! Anodic bonding is a wafer bonding procedure without any intermediate layer. This bonding technique, also known as field assisted bonding or electrostatic sealing, is mostly used for connecting silicon/glass and metal/glass through electric fields. The requirements for anodic bonding are clean and even wafer surfaces and atomic contact between the bonding substrates through a sufficiently powerful electrostatic field. Also necessary is the use of borosilicate glass containing a high concentration of alkali ions. The coefficient of thermal expansion (CTE) of the processed glass needs to be similar to those of the bonding partner.

Оставить комментарий

Оцените книгу:

ISBN: 978-5-5147-9442-3

Книга находится в категориях

ГОСТы, стандарты Экономика Менеджмент (управление)

Вместе с этой книгой покупают