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DAMAGE PREDICTION OF PORTABLE ELECTRONICS. Electronic Packaging, Mechanical Behavior,Life Prediction,Failure Mechanisms and Computational Mechanics

Код 896221

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Аннотация к книге "DAMAGE PREDICTION OF PORTABLE ELECTRONICS. Electronic Packaging, Mechanical Behavior,Life Prediction,Failure Mechanisms and Computational Mechanics"

The fatigue and damage of solder joints and also the potential for interface failure within BGA packages are caused by thermal cycling. In case of portable electronic products, fatigue is caused by repetitive drop and shock during transportation, or vibrations experienced in land-vehicles, air-planes, ships etc. The solder joint failure can then be attributed to the structural dynamics of the product. Therefore there is a need to develop predictive techniques for electronic failure mechanisms...

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Издательство: Книга по требованию
Дата выхода: июль 2011
ISBN: 978-3-6391-8625-3
Объём: 208 страниц
Масса: 338 г
Размеры(высота, ширина, толщина), см: 23 x 16 x 2

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