книги Наука, техника, медицина Техника Транспорт Воздушный транспорт

Sensor Based Modeling of Copper Chemical Mechanical Planarization. Modeling the slurry chemistry effects on Material Removal Rate (MRR)

Код 910007

Нет в продаже

Аннотация к книге "Sensor Based Modeling of Copper Chemical Mechanical Planarization. Modeling the slurry chemistry effects on Material Removal Rate (MRR)"

The variations in slurry chemistry parameters including pH, concentrations of complexing and corrosion inhibiting agents, and slurry flow rates as well as average MRR in Cu-CMP process are modeled using features from two vibration sensors (one wired and the other wireless accelerometer). The study is perhaps one of the first efforts to use wireless vibration sensors for real-time monitoring of MRR and the chief slurry chemistry parameters in CMP. We hope that this work will lead to the advent...

Оставить комментарий

Оцените книгу:

Издательство: Книга по требованию
Дата выхода: июль 2011
ISBN: 978-3-6391-3371-4
Объём: 132 страниц
Масса: 221 г
Размеры(высота, ширина, толщина), см: 23 x 16 x 1

Вместе с этой книгой покупают