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Study of SnAgCu Alloy Reliability. Material Microstructural Evolution and Laser Moire Interferometry

Код 909971

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Аннотация к книге "Study of SnAgCu Alloy Reliability. Material Microstructural Evolution and Laser Moire Interferometry"

This work aims to understand the reliability of SnAgCu solder interconnects used in PBGA packages using microstructure evolution, laser moire interferometry and finite-element modeling. A particle coarsening based microstructure evolution of the solder joint material during thermal excursions was studied for extended periods of time lasting for several months. The microstructure evolution and particle coarsening was quantified, and acceleration factors were determined between benign field-use...

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Издательство: Книга по требованию
Дата выхода: июль 2011
ISBN: 978-3-6391-3327-1
Объём: 188 страниц
Масса: 307 г
Размеры(высота, ширина, толщина), см: 23 x 16 x 1

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